Snapdragon 8 Elite Gen 6: two versions and the beginning of a new naming confusion

Snapdragon 8 Elite Gen 6: Two Versions and the Beginning of a New Naming Confusion

Qualcomm appears unable to stabilize the naming conventions for its high-end chips. After rebranding its flagship to Snapdragon 8 Elite Gen 5 in 2025, the American manufacturer seems poised to revise its naming strategy once again.

This time, things are likely to become even more confusing.

Two Versions of the Snapdragon 8 Elite Gen 6: “Standard” and “Pro”

According to a leak from noted leaker Digital Chat Station, Qualcomm will launch two variants of its upcoming chip:

  • Snapdragon 8 Elite Gen 6 (standard version),
  • Snapdragon 8 Elite Gen 6 Pro (the true high-end chip).

In other words, the direct successor to the Snapdragon 8 Elite Gen 5 will actually be the “Pro” version, while the “standard” model will serve as a lighter version that shares most characteristics but comes with some technical concessions.

A Brief Historical Reminder of Growing Confusion

To understand this puzzle, a look back is necessary:

  • 2022: launch of Snapdragon 8 Gen 1
  • 2023: followed by Gen 2 and Gen 3, in a simple and clear logic
  • 2024: abrupt change → Snapdragon 8 Elite
  • 2025: another adjustment → Snapdragon 8 Elite Gen 5
  • 2026: two versions announced → Gen 6/Gen 6 Pro

And to top it off, Qualcomm is also expected to release a non-Elite Snapdragon 8 Gen 5 for “affordable” high-end smartphones.

This means that three Gen 5/6 chips will coexist simultaneously—a real challenge for manufacturers… and consumers.

Snapdragon 8 Elite Gen 6/Pro—First Technical Details

According to Digital Chat Station:

  • Manufacturing process: TSMC N2P (2 nm, 2nd generation)
  • CPU architecture: Qualcomm custom 3rd generation, featuring a 2 + 3 + 3 core configuration
  • GPU: major difference between the two versions—the Pro model will feature a more powerful GPU and support LPDDR6 (absent in the standard)

This new manufacturing process could provide notable gains in energy efficiency and raw power, but will likely increase production costs, which smartphone manufacturers may need to pass on to their prices.

The first smartphones equipped with the Snapdragon 8 Elite Gen 6 are expected to arrive by late 2026, with an official launch of the chip likely in November 2026.

visual snapdragon8elitegen5 insi scaled

MediaTek Prepares Its Counterattack: Dimensity 9500e and 8500

While Qualcomm gets tangled in its naming, MediaTek is getting ready to strike back in early 2026 with two new high-end chips: the Dimensity 9500e and Dimensity 8500.

Dimensity 9500e: the future direct rival of Snapdragon 8 Gen 5:

  • CPU: 1× Cortex-X925 + 3× Cortex-X4 + 4× Cortex-A720
  • Manufacturing process: TSMC 3 nm (N3E)
  • GPU: Arm G925 MP12, clocked at 1.6 GHz
  • Max CPU frequency: 3.73 GHz

An ambitious architecture, designed purely for performance, equivalent to what Qualcomm will offer in its Elite Gen 6 lineup.

Dimensity 8500: The “Accessible Premium” Alternative

  • Manufacturing process: 4 nm
  • 100% big core configuration (ARM A725 architecture)
  • Max frequency: 3.4 GHz
  • GPU: Mali-G720 at 1.5 GHz
  • Estimated AnTuTu score: ≈ 2.2 million points

These two processors are expected to power smartphones starting January 2026, particularly in the “flagship killer” categories from Vivo, Oppo, and iQOO.

An Increasingly Segmented Premium Market

With the Snapdragon 8 Elite Gen 6/Pro, Snapdragon 8 Gen 5 “standard”, and Dimensity 9500e/8500, the high-end market of 2026 looks set to be more fragmented than ever.

Manufacturers will have to choose between raw power (Elite Gen 6 Pro), cost control (Dimensity 8500), or a balanced option (Snapdragon 8 Gen 5 or 9500e).

In summary:

Chipset

Manufacturing Process

Memory

GPU

Expected Launch

Positioning

Snapdragon 8 Elite Gen 6 Pro

TSMC 2 nm (N2P)

LPDDR6

Adreno “Next-Gen Pro”

Late 2026

Ultra premium

Snapdragon 8 Elite Gen 6

TSMC 2 nm

LPDDR5X

Adreno Gen 6

Late 2026

Standard high-end

Snapdragon 8 Gen 5

TSMC 3 nm

LPDDR5X

Adreno 840

Q4 2025

Sub-flagship

Dimensity 9500e

TSMC 3 nm (N3E)

LPDDR5X

Arm G925 MP12

January 2026

Premium

Dimensity 8500

TSMC 4 nm

LPDDR5X

Mali-G720

January 2026

Upper mid-range

A Competitive Duel Ahead

Qualcomm is preparing chips that are more powerful than ever, but its naming strategy has become a true maze. Meanwhile, MediaTek is capitalizing on clarity and efficiency, with a lineup well-positioned to attract Chinese manufacturers and emerging markets.

In 2026, the battle for mobile processors will not only be about raw power but also the clarity of offerings and production costs.


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