Galaxy S26: Samsung bets on the new Exynos 2600 processor, more powerful than the Apple A19 Pro
According to several Korean media outlets, Samsung is preparing a significant return of its in-house chip with the new Exynos 2600, which will power the upcoming Galaxy S26 series.
The manufacturer has reportedly already initiated mass production of the processor using its 2nm Gate-All-Around (GAA) process—a first that could disrupt the mobile chip landscape.
Traditionally, Samsung reserves its Exynos chips for models sold in Europe and Korea, while devices in the U.S., China, and Japan receive Snapdragon versions. However, this time, the company is considering integrating the Exynos 2600 even into the Galaxy S26 Ultra, a first since the S22 series.
[Exclusive] Galaxy S26 confirmed to feature ‘Exynos 2600’—six times faster than Apple’s chip
The upcoming Galaxy S26 series, set for release early next year, will be equipped with Samsung’s in-house application processor (AP), the Exynos 2600. It is reported that not only the… pic.twitter.com/kGk9277Xs1
— Jukan (@Jukanlosreve) October 20, 2025
Impressive AI and GPU Performance
Reports suggest that the new SoC will deliver six times the AI power of the Apple A19 Pro, which is used in the iPhone 17 Pro. In terms of graphics, it is expected to show +75% GPU performance and +15% multi-core CPU performance compared to Apple’s chip.
Against the Snapdragon 8 Elite Gen 5, Samsung’s processor would also excel with +30% in AI and +29% in GPU performance, based on preliminary internal estimates.
It is said that Samsung is considering using Exynos 2600 for the entire Galaxy S26 series. My God, is the change so big? https://t.co/D18SCgI2yE
— PhoneArt (@UniverseIce) October 20, 2025
A 10-Core Architecture and Improved Thermal Management
The CPU of the Exynos 2600 consists of 10 cores, including one ultra-high-performance core clocked at 3.8 GHz. Another major change is that the modem has been decoupled from the main SoC, freeing up space for computational units and reducing power consumption.
Samsung is also introducing two packaging innovations:
- Heat Pass Block (HPB) for better heat dissipation,
- Fan-Out Wafer Level Packaging (FOWLP) for enhanced overall thermal performance.
A Key Chip for Samsung’s Rebound
After several challenging years for its System LSI division and foundries, Samsung hopes that the Exynos 2600 will mark a revival of its semiconductor strategy. Initial industry feedback indicates significantly improved yields and a reduced technology gap with TSMC.
With this new processor, Samsung appears ready to regain ground against Apple and Qualcomm while bolstering its technological independence. The Galaxy S26 series, expected in early 2026, could herald the impressive return of Exynos in the global high-end market.
