Dimensity 9500e: MediaTek prepares two chips 3 nm and 4 nm for January 2026
The flagship battle in China is coming to an end for 2025, but a new wave of “sub-flagship” smartphones is already on the horizon. These more affordable models than the ultra-premium ones will rely on next-generation chips from Qualcomm and MediaTek.
While Qualcomm is preparing to launch its Snapdragon 8 Gen 5 by the end of this year, MediaTek is gearing up to respond with two new powerful SoCs: the Dimensity 9500e and Dimensity 8500.
According to a leak from the tipster Digital Chat Station, the first smartphones featuring the Dimensity 9500e and 8500 are not expected to arrive until January 2026.
These devices will target the accessible high-end segment while providing specifications worthy of flagship models, including large batteries and high refresh rate displays.
Dimensity 9500e: The Most Powerful Chip from MediaTek to Date
The Dimensity 9500e is positioned as a direct competitor to the Snapdragon 8 Gen 5, promising top-notch performance.
Here are the known specifications:
- CPU: 1× Cortex-X925 + 3× Cortex-X4 + 4× Cortex-A720
- Process: TSMC 3 nm (N3E), the most advanced process from the Taiwanese manufacturer
- GPU: Arm G925 MP12, clocked at 1.61 GHz
- Maximum frequency: 3.73 GHz
This SoC promises excellent energy efficiency and significant CPU/GPU performance gains compared to the Dimensity 9300+.
Dimensity 8500: The Strong “Little Brother”
The Dimensity 8500 targets slightly more affordable models but does not compromise on power.
- Process: TSMC 4 nm
- Architecture: 8 big cores based on ARM Cortex-A725
- Maximum frequency: 3.4 GHz (up from 3.25 GHz on the Dimensity 8400)
- GPU: Mali-G720, clocked at 1.5 GHz
- Estimated AnTuTu score: ≈ 2.2 million points
In summary: even without an “efficiency” core, the Dimensity 8500 emphasizes raw power and intelligent performance management through ARM’s internal scheduler.
Market Positioning
MediaTek appears keen on narrowing the gap with Qualcomm in the high-end market.
- The Dimensity 9500e will target premium models,
- While the Dimensity 8500 will likely power robust devices priced below €600.
To summarize:
| Chip | Process | CPU | GPU | Max Frequency | AnTuTu Score | Expected Launch |
|---|---|---|---|---|---|---|
| Dimensity 9500e | TSMC 3 nm (N3E) | 1×X925 + 3×X4 + 4× A720 | Arm G925 MP12 @1.61GHz | 3.73 GHz | N/A | January 2026 |
| Dimensity 8500 | TSMC 4 nm | 8×A725 | Mali-G720 @1.5GHz | 3.4 GHz | ≈ 2.2M | January 2026 |
MediaTek Aiming to Disrupt the High-End Market
With these two new chips, MediaTek is solidifying its role as a challenger to Qualcomm. The Dimensity 9500e seems poised to directly compete with the upcoming Snapdragon 8 Gen 5/6, while the Dimensity 8500 will offer flagship performance in more budget-friendly smartphones.
If these rumors hold true, 2026 could be the year when MediaTek firmly establishes itself as a major player in the premium segment, thanks to its lead in 3 nm processes and impressive energy efficiency.
