Dimensity 9400++ : MediaTek prepares a 3 nm chip for affordable flagships
The competition between MediaTek and Qualcomm to dominate the affordable premium market is heating up. While Qualcomm is gearing up to launch its Snapdragon 8 Gen 5, MediaTek is preparing to respond with an exciting new SoC—once referred to as Dimensity 9500e but now confirmed as Dimensity 9400++, as per a leak from the well-known leaker Digital Chat Station on Weibo.
The name “Dimensity 9400++” is not just a marketing gimmick. According to shared information, the chip is said to be a direct derivative of the Dimensity 9400+, MediaTek’s flagship processor launched earlier in 2025.
This means it will be a lighter version, yet still highly capable, designed to power premium smartphones without the price tag of ultra-high-end models.
Expected Specifications of Dimensity 9400++/9500e
According to Digital Chat Station, the prototype tested by MediaTek boasts impressive specifications:
Component | Technical Details |
|---|---|
CPU | 1× Cortex-X925 @ 3.73 GHz + 3× Cortex-X4 + 4× Cortex-A720 |
GPU | Arm Immortalis-G925 MP12 @ 1612 MHz |
Process | TSMC N3E (3 nm) |
Cache & Architecture | Identical to Dimensity 9400+ |
Estimated Performance | Very close to flagship Dimensity 9400+ |
Target | “Sub-flagship” segment (affordable premium) |
In essence, MediaTek appears to have retained the same CPU/GPU architecture as its flagship model while adjusting frequencies and power consumption to make it more efficient and cost-effective.
Upcoming Comprehensive Smartphones
The leaker indicates that the first smartphones featuring this new SoC will stand out due to larger batteries, premium displays (likely OLED LTPO 120 Hz or higher), and a more upscale build than typical mid-range models.
This suggests that MediaTek is targeting the “affordable flagships” segment—an area where Chinese manufacturers such as Vivo, Xiaomi, Honor, and Realme are particularly active.
Expected Launch in Q1 2026
According to a leaked roadmap, the Dimensity 9400++ (or 9500e) is set to be announced in the first quarter of 2026. This coincides with Qualcomm’s plans to commercially deploy its Snapdragon 8 Gen 5, already unveiled in late 2025.
In other words, the two chips will directly compete at the beginning of 2026 with the next “flagship killer” models on the market.
A Clear Strategy: Undermining Qualcomm in the Premium Segment
With this chip, MediaTek aims to close the gap between high-end and ultra-high-end while leveraging TSMC’s 3 nm process to offer:
- Better energy efficiency,
- More stable sustained performance,
- A lower production cost compared to Snapdragon 8 Gen 5.
The Dimensity 9400++ could thus power smartphones priced between $600 and $800, a price range where MediaTek becomes increasingly competitive against Qualcomm.
While the Dimensity 9400++ may not be a technical revolution, it represents a smart strategic move. By recycling a proven high-end architecture and offering it at a more affordable cost, MediaTek aims to dominate the affordable flagship market—where growth is the strongest.
If its performance holds up, this processor could become the Snapdragon 8 Gen 5 “killer” that MediaTek has long awaited.
