The iPad Pro M6 expected in 2027 would adopt a new vapor chamber cooling system
Apple is reportedly preparing a significant thermal upgrade for the next generation of the iPad Pro. According to Mark Gurman (Bloomberg), Apple is developing a vapor chamber cooling system expected to debut alongside the M6 chip in spring 2027.
Already introduced in the iPhone 17 Pro and 17 Pro Max at the end of 2025, the vapor chamber is a type of liquid cooling that efficiently dissipates heat from high-performance components without the need for a fan.
Apple has reportedly optimized this technology, which has long been in use by Samsung and other brands, to enhance thermal stability and avoid overheating seen in some previous models.
Why Does the iPad Pro M6 Need It?
The current iPad Pro M5 already achieves performance levels comparable to a Mac Studio running on the M1 Ultra chip. However, this power comes at a cost: extended sessions of video editing, gaming, or AI applications generate heat that can be hard to manage.
The upcoming vapor chamber system would help to:
- Reduce thermal throttling,
- Maintain high performance for longer periods,
- And keep the tablet slim and silent, still without a fan.
Rumors suggest this decision is also a response to feedback on the MacBook Pro M5, where some users reported thermal limitations preventing the processor from reaching its full power.
A New Era for the iPad Pro and Beyond
The future iPad Pro M6, fabricated in 2 nm by TSMC, promises significant gains in power and energy efficiency. Combined with this new cooling solution, it could further push the boundaries of the tablet format. Apple is even considering extending this technology to other fanless products, like the MacBook Air, to enhance thermal stability without compromising design.
A Launch Expected in Spring 2027
According to the usual 18-month renewal cycle for the iPad Pro, the M6 model is expected to be released around spring 2027. This would mark a new milestone in bridging the gap between high-performance tablets and laptops, with a thermal approach finally matching the power of Apple Silicon chips.
